VLSI SPECSSearch VLSI Specs
50 matching records. Preview records are clearly labeled and excluded from public indexing until their evidence is complete.
HBM3E
Structured memory-generation record for condition-aware comparison.
Memory · preview02HBM4 product family
Supplier-specific HBM4 products, interfaces and related systems.
Memory · preview03UCIe 2.0
Interface entity connected to packages, chiplets and public standards metadata.
Interface · source-linked042 nm-class Process
Neutral process-family record that prevents cross-foundry marketing labels from being treated as equivalent.
Manufacturing · preview052.5D Packaging
Packaging-family record for interposer, bridge and chiplet comparisons.
Packaging · preview06UCIe 3.0
Version record for public release metadata and mode-conditioned comparisons.
Interface · source-linked07UCIe 1.1
Backward-compatible UCIe revision record.
Interface · source-linked08CXL 4.0
Publicly announced CXL revision; retain version, release date and access conditions only.
Interface · source-linked09CXL 3.2
Version-level record for a released CXL specification.
Interface · source-linked10CXL 3.1
Source-linked revision entity for fabric and memory-system research.
Interface · source-linked11CXL 3.0
Source-linked CXL revision with public high-level protocol taxonomy.
Interface · source-linked12HBM4
Standards-taxonomy entity; capacities and bandwidth remain product-specific.
Memory · source-linked13SPHBM4
JEDEC-named HBM4-class bandwidth standard entity; preserve product and topology conditions.
Memory · source-linked14DDR5 MRDIMM
Memory-module ecosystem entity tracked as public standards metadata.
Memory · preview15RISC-V RVA23
Profile entity with status and implementation scope separated.
Compute Architecture · source-linked16RISC-V Vector Extension
Open ISA extension entity with version-specific source links.
Compute Architecture · source-linked17OpenLane 2
Open-source ASIC-flow entity for reproducible toolchain navigation.
EDA Flow · source-linked18OpenROAD
Open-source physical-design platform entity.
EDA Flow · source-linked19SkyWater SKY130
Open PDK entity; record exact PDK release/variant in child fields.
Manufacturing · source-linked20GF180MCU
Open PDK entity for process-aware educational flow navigation.
Manufacturing · source-linked21Intel 18A
Foundry technology node entity; commercial availability requires dated source verification.
Manufacturing · source-linked22TSMC N2
Foundry-specific node entity, not a cross-foundry equivalence class.
Manufacturing · source-linked23Samsung SF2
Foundry-specific process entity with date-sensitive commercialization metadata.
Manufacturing · source-linked24IEEE 1149.4-2024
Active mixed-signal test-bus standard tracked at public catalog-metadata level; controlled normative text is not reproduced.
Standard · source-linked25SEMI E10-0422
Current equipment reliability, availability, maintainability and utilization standard represented from SEMI's public store metadata.
Standard · source-linked26SEMI E12-0421
Current mass-flow measurement units guide represented from SEMI's public catalog without reproducing the paid document.
Standard · source-linked27IEC 61508-1:2010
Functional-safety general-requirements edition tracked from the IEC Webstore at catalog-metadata level.
Standard · source-linked28AEC-Q100 Revision H
Automotive integrated-circuit qualification document family indexed from the official AEC document register; issue date is not asserted.
Standard · source-linked29MIL-STD-883-1 Change 2
Active microcircuit environmental-test-method standard tracked from the official DLA ASSIST catalog.
Standard · source-linked30IPC-A-610 Revision J
Current electronics-assembly acceptance revision indexed from IPC's public revision table; commercial standard text is excluded.
Standard · source-linked31MIPI D-PHY v3.6
Current D-PHY version and public scope metadata linked to the official MIPI overview; member-only specification text is excluded.
Standard · source-linked32MIPI CSI-2 v4.2
Current CSI-2 version and public imaging-interface metadata linked to MIPI; member-only specification text is excluded.
Standard · source-linked33PCI Express 7.0
Public release metadata for the PCIe 7.0 base specification.
Interface · source-linked34PCI Express 6.x
Revision-family record; electrical and protocol details remain version-specific.
Interface · source-linked35USB4 Version 2.0
Public USB4 revision metadata without reproducing controlled specification text.
Interface · source-linked36UCIe 1.0
First released UCIe generation represented at version-metadata level.
Interface · source-linked37CXL 2.0
Released CXL revision with only public high-level feature metadata.
Interface · source-linked38CXL 1.1
Historical CXL revision retained for compatibility and genealogy research.
Interface · source-linked39RISC-V RVA22 Profile
Ratified application-processor profile metadata linked to the official reference.
Architecture · source-linked40TSMC A16
Foundry-specific A16 process record; no cross-foundry node equivalence is implied.
Manufacturing · source-linked41TSMC N2P
N2-family extension represented from TSMC's own process taxonomy.
Manufacturing · source-linked42TSMC N3P
N3-family process variant represented without normalized cross-foundry claims.
Manufacturing · source-linked43Intel 14A
Intel Foundry process record using Intel's public architecture and power-delivery labels.
Manufacturing · source-linked44Samsung SF2Z
Samsung Foundry process variant with publicly announced backside power delivery.
Manufacturing · source-linked45Samsung SF4U
Samsung Foundry 4 nm-family variant tracked as an announced foundry-specific label.
Manufacturing · source-linked46TSMC CoWoS
TSMC's chip-on-wafer-on-substrate advanced-packaging family.
Packaging · source-linked47Intel EMIB
Intel's embedded bridge packaging technology represented at public taxonomy level.
Packaging · source-linked48Intel Foveros Direct
Intel 3D packaging technology with public hybrid-bonding taxonomy.
Packaging · source-linked49Samsung I-Cube
Samsung 2.5D packaging family represented from its official technology catalog.
Packaging · source-linked50Samsung X-Cube
Samsung 3D integration family represented without product-level supplier inference.
Packaging · source-linked